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Architect - Hardware Packaging

Ather Energy

Skills

Required

  • GD&T
  • manufacturing processes
  • plastics
  • sheet metal
  • pressure die-casting
  • DFMEA
  • risk mitigation methodologies
  • product development life cycles

Preferred

  • hardware packaging
  • charging infrastructure
  • modular design principles
  • physical layout architectures
  • Hardware Architecture
  • OTS
  • Build-To-Spec BTS
  • BTP

Hardware Packaging Architect Location: IBC Knowledge Park, Bengaluru Reporting to: Team Lead - Hardware Packaging Team name: Hardware Packaging Engineering About the Team and the Role The Hardware Packaging team at Ather drives the physical design and structural packaging of our next-generation electric vehicle and charging infrastructure platforms, aligning closely with organizational strategic objectives and engineering roadmaps. As a Hardware Packaging Architect, you will own the end-to-end mechanical and structural packaging architecture, leading cross-functional integration to ensure high reliability, optimal performance, stringent quality, and cost efficiency.

About Ather Energy

Want to know more?

  • At Ather, we’ve built India’s first intelligent scooter, from scratch.
  • Based on the philosophy of clean design and smart technology, we are transforming the urban commute experience.
  • We are expanding in India, and in the coming years, we look forward to scaling up and launching more products globally.
  • Today, our product offerings include the Ather 450X, 450S, 450 Apex, and Rizta.
  • Beyond the product, we are also setting up an extensive charging network and re-imagining end-to-end ownership experience.
  • To know more, check out our Careers site and our Substack.
  • Be You, With Us The Ather story doesn't write itself - our people do.
  • We believe everyone is equal, but not the same.
  • Diversity is our strength, and building an inclusive and equitable workplace begins with acknowledging and embracing our differences.

Responsibilities

  • Lead the end-to-end design and packaging architecture for vehicle systems and charging infrastructure in alignment with platform requirements.
  • Drive product engineering from concept creation down to component levels, consistently achieving schedule, performance, structural, and cost targets.
  • Spearhead the hardware packaging technology roadmap through modular design principles and innovative physical layout architectures.
  • Author and maintain central physical layout specifications within the Hardware Architecture Master Document.
  • Guide component selection for Off-The-Shelf (OTS), Build-To-Spec (BTS), and Build-To-Print (BTP) parts, while designing proprietary box-build enclosures.
  • Define and execute strategies for thermal management, ingress protection (IP ratings), environmental sealing, and structural venting.
  • Lead engineering design reviews, DFMEA/AFMEA studies, material selection analysis, and manufacturing strategy evaluations.
  • Mentor engineering talent, conduct competency assessments, and resolve complex technical root causes.
  • Ensure compliance with international standards and regulatory testing (UL, ARAI, BIS, IEC) for electronics and electrical assemblies.
  • Maximize platform reusability and design modularity to accelerate time-to-market (TTM), lower unit cost, and enhance quality standards.
  • Experience and Qualifications 8–10 years of experience in hardware packaging, mechanical design, or electromechanical architecture.
  • Bachelor’s or Master’s degree (B.E./B.Tech/M.Tech) in Mechanical, Mechatronics, or related engineering discipline from a recognized institute.

Requirements

  • Competencies Deep expertise in 1D/3D stack-up tolerance analysis and GD&T. Comprehensive understanding of manufacturing processes (plastics, sheet metal, pressure die-casting, and advanced fabrication techniques).
  • Strong abstract thinking and system-level conceptualization capabilities.
  • Proficiency in DFMEA, AFMEA, and risk mitigation methodologies.
  • Ability to align product architecture and platform roadmaps with advanced manufacturing capabilities.
  • Proven experience in high-density and high-voltage electronic packaging.
  • Track record of delivering at least three full product development life cycles from concept through mass production.
  • Expertise in material science selection for automotive and power electronics environments.
  • Structured problem-solving skills using industry best practices (5-Why, Fishbone, RCA, 8D).
  • Good to have Competencies Familiarity with Rigid body dynamics and Engineering mechanics of solids.
  • Knowledge of Structural Design principles.
  • Understanding of Materials and their properties.
  • Familiarity with Sealing strategies, testing and detection .

We are an equal opportunity employer, and our team reflects a wide range of identities, experiences, and perspectives - all united by a shared passion to shape the Ather journey.