Advanced Packaging Development Engineer

Apple’s Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future products. In this role, you will lead the definition, development, and qualification of cutting-edge 2.5D and 3D packaging technologies—incorporating features such as hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs).

You will work cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing.

## Description

In this role, you will be responsible for advanced package integration and technology development within a cross-functional team, driving novel 2.5D/3D architectures from early concept through qualification.

## Minimum qualifications

Bachelor's degree required.

## Preferred qualifications

• PhD and experience in relevant industry, preferred.
• Strong technical background in 2.5D/3D packaging and semiconductor integration schemes (such as hybrid bonding, interposers, fine-pitch microbumps, and TSVs).
• Solid grasp of fab BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows.
• Understanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms.
• Broad systems mindset with the ability to balance package-level choices against silicon, electrical, thermal, and manufacturing constraints.
• Experience utilizing layout, physical design, or modeling tools alongside engineering data analysis.
• Proven track record collaborating with and driving external foundries, OSATs, or material vendors.
• Excellent communication and collaboration skills across cross-functional hardware teams.