jobapplier

Engineering Manager - AI Server RMA (Field Repair) Operation

Foxconn Industrial Internet - FII

Skills

Required

  • failure analysis / manufacturing / repair / RMA / NPI / field-return operations
  • Mechanical
  • Manufacturing Engineering
  • computing
  • electronics
  • networking

Preferred

  • AI / GPU / HPC / hyperscale / enterprise server platforms
  • GPU/CPU architecture
  • DDR memory
  • PCIe
  • BMC
  • BIOS
  • firmware
  • telemetry
  • system-event-log diagnostics

Manager - AI Server RMA (Field Repair) Operation Position Summary This position is responsible for the technical performance of the RMA operation, including server diagnostics, root-cause analysis, repair process development, liquid-cooling integrity, test validation, repair yield, and customer technical escalations .

Responsibilities

  • The successful candidate will combine strong technical expertise with hands-on factory leadership, managing engineers while partnering with Manufacturing, Quality, Test Engineering, Process Engineering, Supply Chain, Program Management, suppliers, and customer engineering teams.
  • rapidly restore customer systems while identifying and eliminating the root causes that drive repeat failures.
  • Engineering & RMA Leadership Lead engineers supporting customer returns, RMA repair, refurbishment, and field-failure investigations.
  • Establish standardized diagnostic, repair, validation, and engineering escalation processes.
  • Provide technical leadership for complex AI server failures that cannot be resolved through standard troubleshooting procedures.
  • Manage engineering resources based on customer severity, RMA aging, production impact, and business risk.
  • Develop engineers and technicians through coaching, technical training, certification, and structured problem-solving practices.
  • symptom → reproduction → isolation → root cause → corrective action → validation → closure .
  • Reduce unnecessary component replacement, repeated troubleshooting, and No Trouble Found (NTF) cases.
  • Lead structured investigations using 8D, 5 Why, Fishbone, Pareto, FMEA, fault-tree analysis, DMAIC, and DOE , as appropriate.
  • Analyze RMA and field-failure data to identify product, process, supplier, firmware, workmanship, and test-coverage improvement opportunities.
  • Partner with Design, Manufacturing, Quality, suppliers, and customer engineering teams to implement permanent corrective actions.
  • Provide RMA lessons learned and Design-for-Serviceability/Repairability feedback into NPI and future AI server platforms.
  • Key Performance Indicators First Pass Yield (FPY) / Repair Yield First Time Fix / First Time Right Mean Time to Repair (MTTR) RMA Turnaround Time & Aging Repeat RMA / Repeat Failure Rate No Trouble Found (NTF) Rate Root-Cause & Corrective-Action Closure Engineering Hold Aging Success requires balancing repair speed, technical accuracy, product quality, cost, and customer satisfaction , rather than simply maximizing repair volume.
  • Customer & Cross-Functional Leadership Serve as a senior technical escalation point for critical customer and field issues.
  • Coordinate containment, failure reproduction, root-cause investigation, corrective action, validation, and effectiveness monitoring.
  • Lead technical reviews and communicate complex failures clearly to engineering, operations, customers, and executive leadership.
  • Work closely with Manufacturing, Quality, Test, Process Engineering, NPI, Program Management, Supply Chain, suppliers, and customer engineering organizations.
  • Ensure field-return data is translated into actionable improvements to manufacturing processes, test coverage, supplier quality, firmware, and product design.

Requirements

  • Qualifications Education Bachelor's degree in Electrical, Electronics, Computer, Mechanical, Manufacturing Engineering , or a related technical discipline.
  • Equivalent relevant technical and leadership experience may be considered.
  • Experience 5+ years of engineering experience in servers, computing, electronics, networking, high-tech manufacturing, or related industries.
  • 3+ years of engineering leadership or people-management experience.
  • Strong experience with system-level troubleshooting, failure analysis, manufacturing, repair, RMA, NPI, or field-return operations .
  • Demonstrated ability to lead complex root-cause investigations and corrective actions.
  • Experience working directly with customers, suppliers, or customer engineering organizations.
  • Hands-on technical leadership and willingness to engage directly in complex debug situations
  • Strong root-cause and structured problem-solving discipline Data-driven decision making and KPI ownership
  • Ability to lead engineering teams in a fast-paced factory/RMA environment
  • Strong customer focus and urgency without sacrificing technical rigor
  • Effective cross-functional and supplier leadership

Clear written, verbal, and executive-level communication

  • Ability to develop engineers, technical leads, and repair technicians
  • Above all, this leader understands the difference between replacing the failed part, repairing the system, and eliminating the root cause .

Preferred

  • Technical Qualifications Strong candidates will have experience with several of the following: AI, GPU, HPC, hyperscale, or enterprise server platforms GPU/CPU architecture, DDR memory, PCIe, NVMe, and high-speed networking BMC, BIOS, firmware, telemetry, and system-event-log diagnostics
  • Liquid cooling, cold plates, QDs/QDCs, manifolds, coolant handling, flow/pressure fundamentals, and leak testing High-volume electronics manufacturing and RMA operations 8D, FMEA, SPC, DOE, CAPA, and Six Sigma methodologies MES, PLM, QMS, ERP, and RMA tracking systems ISO 9001 or similar quality-management environments Accelerated-computing or advanced GPU server architectures
  • Leadership Competencies The successful