SiP Simulation and Virtual Prototyping Specialist (m/f/d)

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About Aumovio

The future of mobility isn’t just anyone’s job. ​Make it yours! ​Join AUMOVIO.

Own What’s Next.​

• Since its spin-off in September 2025 AUMOVIO continues the business of the former Continental group sector Automotive as an independent company.
• The technology and electronics company offers a wide-ranging portfolio that makes mobility safe, exciting, connected, and autonomous.
• This includes sensor solutions, displays, braking and comfort systems as well as comprehensive expertise in software, architecture platforms, and assistance systems for software-defined vehicles.
• In the fiscal year 2024 the business areas, which now belong to AUMOVIO, generated sales of 19.6 billion Euro.
• The company is headquartered in Frankfurt, Germany and has about 87.000 employees in more than 100 locations worldwide.

Responsibilities

• The SiP Simulation and Virtual Prototyping Specialist (m/f/d) is responsible for following tasks: Establishing and maintaining the multidisciplinary simulation and electronic design automation tool chain required for SiP feasibility and design studies
• Responsibility for electrical, thermal, mechanical and thermo-mechanical modeling of SiP concepts across die, interconnect, package and board boundaries
• Defining model requirements, simulation methods, boundary conditions, correlation approaches and sign-off criteria
• Producing traceable simulation evidence that supports architecture selection, package design decisions and technical risk reduction
• Integrating external partner models and results into a controlled and reusable AESS virtual development environment
• Defining the SiP simulation strategy and selecting, configuring and integrating suitable tools for signal integrity, power integrity, thermal, mechanical, thermo-mechanical and reliability analysis
• Building parameterized models of dies, chiplets, passives, interconnects, substrates, interposers, package materials, heat paths and relevant board interfaces
• Performing signal-integrity analyses for die-to-die and external interfaces, including insertion loss, return loss, crosstalk, timing margins and channel compliance
• Performing power-integrity analyses covering power-delivery-network impedance, voltage drop, current density, simultaneous switching effects and decoupling concepts
• Performing steady-state and transient thermal analyses and evaluating junction temperatures, thermal gradients, heat spreading and cooling concepts
• Performing mechanical and thermo-mechanical analyses covering package warpage, stress, strain, fatigue and reliability risks of interconnects and material interfaces
• Defining simulation inputs, model fidelity, material properties, meshing strategies, boundary conditions, uncertainty ranges and acceptance criteria
• Correlating models with supplier data, analytical calculations, measurements or prototype results and document model limitations and confidence
• Automating repeatable simulation workflows, design-space exploration, result post-processing and reporting using suitable scripting methods
• Maintaining simulation libraries, templates, version control, documentation and interfaces to package design and system-level modeling environments
• Motivation and Inspiration Team player and contributes towards team goals

Requirements

• Academic degree in Electrical Engineering, Microelectronics or comparable qualification In-depth experience in semiconductor technology
• Longterm experience in IC design methodology and EDA tools
• Several years of experience in multiphysics simulation for semiconductor packages, electronic assemblies or heterogeneous integration In-depth experience in at least two of the following domains signal integrity power integrity thermal analysis mechanical analysis thermo-mechanical reliability
• Experience with relevant simulation environments such as Ansys, Cadence, Siemens or equivalent industry tools
• Deep Knowledge of package and substrate structures, material properties, interconnect technologies and semiconductor package failure mechanisms
• Experience with model-order reduction, compact models, parameter extraction, sensitivity analysis and design-space exploration is preferred
• Business fluent English language skills (written and spoken), German language skills desirable
• Initiative - self-confident, takes ownership and acts proactively
• Ability to learn continuously by being open and flexible to new tasks/fields
• Good communication skills
• Customer focus - anticipates and understands the customers' needs
• Methodological rigor Tool-chain ownership Cross-domain collaboration

Preferred

• Experience in simulation workflow automation and scripting, for example with Python preferred
• Experience correlating simulation results with measurements, supplier models or prototype data is preferred

Benefits

• Next to the interesting daily work the region around Regensburg is offering a high recreational value and quality of life.
• Profit from extensive benefits at the location such as different canteens and cafeterias, a continuing education and training, health management, physiotherapy and much more.
• We offer an attractive salary as well as the possibility of hybrid and cross-border mobile work.
• For an improved work-life balance we support you with various initiatives for a better compatibility of family and career such as flexible work time model, part-time option, sabbatical, etc.
• You can expect a highly motivated team as well as diverse topics and projects in the global environment of the automotive industry.
• We are promoting lifelong Learning combined with personal and professional development.
• You are looking for an individual working time model?