SiP Package Development Specialist (m/f/d)

The SiP Package Development Specialist (m/f/d) is responsible for following tasks: Defining technically viable and cost-effective System-in-Package (SiP) concepts using bare-die known-good-die components, passives and, in later phases, multi-vendor chiplets

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About Aumovio

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• Since its spin-off in September 2025 AUMOVIO continues the business of the former Continental group sector Automotive as an independent company.
• The technology and electronics company offers a wide-ranging portfolio that makes mobility safe, exciting, connected, and autonomous.
• This includes sensor solutions, displays, braking and comfort systems as well as comprehensive expertise in software, architecture platforms, and assistance systems for software-defined vehicles.
• In the fiscal year 2024 the business areas, which now belong to AUMOVIO, generated sales of 19.6 billion Euro.
• The company is headquartered in Frankfurt, Germany and has about 87.000 employees in more than 100 locations worldwide.

Responsibilities

• Selecting and assessing package architectures, substrate and interposer technologies, interconnect concepts, materials and assembly processes against product requirements
• Coordinating packaging feasibility work with external manufacturing partners such as outsourced semiconductor assembly and test providers and pilot lines
• Responsibility for package technology requirements, design rules, cost assumptions, technical risks and concept documentation throughout feasibility and demonstrator activities
• Ensuring that package concepts consider manufacturability, testability, reliability, supply-chain constraints and future automotive qualification needs
• Deriving package-level requirements from product architecture, component data and environmental, electrical, thermal, mechanical, reliability and cost targets
• Developing and comparing 2D, 2.5D and 3D SiP concepts, including organic substrates, redistribution-layer structures, interposers, embedded components and appropriate die-attach and interconnect options
• Defining preliminary package stack-ups, material systems, bump and pad concepts, die placement constraints, assembly flows and package design rules
• Assessing the suitability and availability of bare-die known-good-die components, passives and chiplets for integration into proposed SiP concepts
• Leading package technology trade-off studies covering performance, size, thermal behavior, reliability, manufacturability, yield, schedule, supply risk and cost
• Coordinating concept reviews and feasibility studies with outsourced semiconductor assembly and test providers, substrate suppliers, foundries, pilot lines and engineering partners
• Defining inputs, boundary conditions and acceptance criteria for electrical, thermal, thermo-mechanical and reliability simulations
• Establishing package specifications, architecture documents, design-rule baselines, bills of material and technical decision records
• Supporting prototype planning, design reviews, failure analysis and the transfer of learning into reusable SiP design guidelines
• Monitoring relevant packaging technologies, supplier capabilities and industry standards and translate findings into the AESS SiP technology roadmap
• Profound experience in package architecture trade-offs involving electrical, thermal, mechanical, reliability, manufacturability and cost constraints
• Experience in working with outsourced semiconductor assembly and test providers, substrate suppliers, foundries or semiconductor pilot lines
• Deep knowledge of package design rules, assembly process flows, design for manufacturability and package qualification principles
• Documentation discipline Customer focus - anticipating and understanding the customers' needs
• Motivation and Inspiration Team player and contributes towards team goals

Requirements

• Academic degree in Electrical Engineering, Microelectronics or comparable qualification In-depth experience in semiconductor technology Long-term experience in IC design methodology and EDA tools
• Several years of experience in semiconductor package development, advanced packaging, System-in-Package or heterogeneous integration In-depth knowledge of package substrates, redistribution layers, interposers, die attach, wire bonding, flip chip, micro-bumps, underfills, molding compounds and thermal interface materials
• Deep knowledge of automotive semiconductor reliability expectations and relevant qualification and quality methods is preferred
• Experience in technical supplier assessment, feasibility studies and structured risk analysis is preferred
• System thinking by translating product needs into balanced package concepts and clear technical requirements
• Business fluent English language skills (written and spoken), German language skills desirable
• Initiative - self-confident, takes ownership and acts proactively
• Ability to learn continuously by being open and flexible to new tasks/fields
• Good Communication skills
• Technical judgement skills
• Partner management skills

Benefits

• Next to the interesting daily work the region around Regensburg is offering a high recreational value and quality of life.
• Profit from extensive benefits at the location such as different canteens and cafeterias, a continuing education and training, health management, physiotherapy and much more.
• We offer an attractive salary as well as the possibility of hybrid and cross-border mobile work.
• For an improved work-life balance we support you with various initiatives for a better compatibility of family and career such as flexible work time model, part-time option, sabbatical, etc.
• You can expect a highly motivated team as well as diverse topics and projects in the global environment of the automotive industry.
• We are promoting lifelong Learning combined with personal and professional development.
• You are looking for an individual working time model?
• We support part-time work.