Operator B Shift

Responsible for wafer fabrication within an assigned functional area such as: photo resist application, bake, align, expose, develop/inspect, oxide and metal etching, and wafer cleaning according to specifications.

Responsibilities

• Perform production processes as assigned by Supervisor / Manager in such areas: Photo, Etch, Thin films, Metal dep, Diffusion, Epi, LPCVD and including all support areas.
• Inspect wafers to ensure proper processing and wafer quality.
• Properly log all processed and in process wafers using Net Vision system.
• Support company initiatives, such as; quality, safety and environmental management, CQ1, 5S, yield management, and cost containment.
• Perform other duties as required.

Requirements

• High School Diploma or GED SKILLS AND KNOWLEDGE: Required skills in basic reading, writing, and arithmetic, simple communication.
• Must be able to follow established methods and procedures and perform work accordingly.
• Requires walking and standing on cleanroom floors for prolonged periods.

Preferred

• Equipment set-up training of lower level operators, and certification in a given number of functional areas.

Pay

• B-Shift (Sun, Mon, Tue, eo Wed 5:50pm – 6am) Pay: $19.00 per hour plus 14% shift differential and overtime!
• Total hourly salary - $21.66, plus annual incentive program.

Benefits

• Full-time employees will be eligible to receive the following benefits and additional compensation: Medical, Dental and Vision Insurance Paid Time Off starting the first day 401k including a generous company match Tuition assistance Disability and life insurance Legal and ID theft insurance Employee Assistance Program Annual Incentive Program (Bonus) *Sponsorship is not available for this position now or in the future.

PHYSICAL DEMANDS/WORKING CONDITIONS

Working in a cleanroom environment and wearing clean room attire (bunny suit, mask, gloves, protective eye wear and booties). Exposure to hazardous chemicals and extreme oven temperatures, 550-800C. Lift/carry/push/pull/ up to 10 pounds on a frequent and daily basis. Visual acuity. Ability to perform all wafer handling functions (i.e.: load, unload, transfer, transport, etc.). Manual dexterity to operate hand held devices such as; keyboard, keypad, mouse/trackball, scanner and wand. Ability to perform two handed cassette/wafer handling including two handed grip and grasp, on a frequent to continuous and daily basis. Ability to perform physical requirements throughout the course of 12-hour shifts.