jobapplier

Senior Staff Device Characterization Engineer

Renesas Electronics

Skills

Required

  • semiconductor device characterization
  • HP RMB / SPECS
  • Splus/R / Python / MatLab / JMP
  • Unix systems
  • Automated probers
  • Semiconductor parameter analyzers
  • S-parameter systems
  • semiconductor layout
  • Cadence
  • Virtuoso
  • underlying device physics

Preferred

  • probers
  • process and device characterization testing
  • EPROM testing
  • device raw
  • I-V curves

More information will be provided during the hiring process.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement . Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

About Renesas Electronics

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier .

With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial.

It shapes how we work, grow and deliver on our purpose together.

Are you ready to join our team and shape the future with us?

Responsibilities

  • Utilize HP4062/4073 testers with EG2080, EG4090, and TEL Precio XL probers, leveraging custom RMB code.
  • Work with HP8753 and Cascade full-temperature probers using HP IC-CAP software.
  • Agilent B1500 with a manual probe station.
  • Perform measurements on wafer level and package parts.
  • Measurements include process and device characterization testing, EPROM testing, device raw I-V curves as well as reliability tests like HCI and HTRB.
  • Conduct transient manual measurements, such as Gate charge and Reverse recovery.
  • S-Parameter measurements using as HP8753D with manual probe station and IC-CAP software.
  • Develop new software as needed by device development and modeling team.
  • Work with other team members to debug test chip programs.
  • As testing requirements change, upgrade hardware and software to meet needs

Requirements

  • Bachelor's or Master’s degree in Electrical Engineering. A minimum of 10 years of hands-on experience in semiconductor device characterization. Familiarity with HP RMB or SPECS. Familiarity with Splus/R, Python, MatLab or JMP a plus. Familiarity with Unix systems. Proficiency in using various electronic lab equipment, including but not limited to: Automated probers Semiconductor parameter analyzers S-parameter systems Experience in semiconductor layout using tools like Cadence Virtuoso. Knowledge of underlying device physics of tested devices.

Benefits

  • This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
  • We believe in rewarding our employees with a competitive benefits package alongside their salary.
  • Join our Technology Development (TD) team as a Senior Engineer and contribute to cutting-edge projects in power device development and semiconductor device characterization.