jobapplier

Advanced Packaging & Integration Lead

Equal1

Responsibilities

  • Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules.
  • Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding.
  • Ensure packaging architectures and interconnects can withstand thermal cycling down to the millikelvin regime without delamination or loss of reliability.
  • Contribute to early-stage architecture and co-design activities, ensuring the advanced packaging subsystem scales with the requirements of the overall quantum system.
  • Develop simulation approaches to evaluate packaging and process options at DC and RF frequencies, including signal integrity, power integrity, thermal performance, and mechanical stress.
  • Balance R&D execution with a strong focus on yield improvement, failure analysis, manufacturability, and long-term hardware reliability.
  • Own relevant technical activities with external suppliers, OSATs, and research partners.
  • Support the transfer of novel packaging designs into external manufacturing and advanced packaging lines.

Preferred

  • Experience with cryogenic electronics, semiconductor physics, or silicon spin qubits.
  • Knowledge of material behaviour at extreme temperatures, including superconductors and low-loss dielectrics.
  • Experience leading or mentoring engineers in a high-tech, fast-paced R&D environment.

Required

  • Master’s or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field.
  • 7+ years’ experience in 3D integration and advanced packaging, including TSVs, fine-pitch micro-bumps, and flip-chip bonding.
  • Experience with 3D-IC layout, planning, and simulation platforms for multi-die co-design, TSV floorplanning, and vertical interconnect planning.
  • Experience with multi-physics analysis tools such as Ansys HFSS/Q3D or equivalent for signal/power integrity, RF analysis, and cryogenic structural/thermal stress.
  • Experience managing technical transfers and working closely with external semiconductor advanced packaging facilities, OSATs, or research partners.
  • Proven ability to guide technical strategy and work effectively across multidisciplinary engineering teams.